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Vlink High Speed AWG Optical Device Package

AWG packaging process includes coupling alignment and bonding operations. The coupling of the AWG chip to the fiber arra···

docx 1.25Mb 27 2023-02-26
The difference between MPO and MTP

Within the repaid development of applications of all industrial, such as data center, cloud computing, cloud storage. et···

docx 0.37Mb 31 2023-02-26
4x25G PSM4 and CWDM4 Technology

The traditional data center is mainly based on the 10G network architecture. In order to adapt to the scale deployment o···

docx 3.76Mb 24 2023-02-26
How can VLINK control the core pitch error of the V groove and Fiber Array?

1.How can Vlink control the core pitch error of the V groove and Fiber Array? A: VLINK has the most advanced Fiber Array···

docx 0.23Mb 24 2023-02-26
How can VLINK customize the product research design?

1. How can VLINK customize the product research design? A: For FA design, research, and production, our company has many···

docx 0.02Mb 23 2023-02-26
FA Product Process Skill

1.Which kinds of adhesives does VLINK use? A:VLINK as long use original imported adhesives, according to customer applic···

docx 0.02Mb 27 2023-02-26
Packaging of Silicon Photonics Modules and VLINK’s Micro-Connectivity on Silicon Photonics

docx 0.77Mb 24 2023-02-26
MPO/ MTP® Parallel Optics Technology in High Speed Data Center Application

pdf 0.98Mb 21 2023-02-26