1. To avoid the interference of FA cover plate in the process of chip coupling, Vlink developed the FA without cover plate
2. Vlink has OPTEK 3500 CO2 laser fiber cutter, and uses the laser cutting platform to develop the fiber extension FA, with an angle of 0~45 ° and an extension of 50~300um
3. Through strict control of product process and raw materials, Vlink developed FA for Reflow environment, with a tolerance temperature of 200~260 ℃
| Parameter | 1ch | 2ch | 4ch | 8ch | 16ch | 24ch |
| Working wavelength(nm) | 850~1620 or others | |||||
| Fiber type | Corning/YOFCG657A1/G657A2/G657B3/0M3/0M4 | |||||
| Insertion loss(dB) | ≤0.1 | |||||
| Return loss(dB) | ≥50 | |||||
| Working temperature(℃) | -5~70 | |||||
| Storage temperature(℃) | -40~85 | |||||
| Core pitch | 81um、127um、250um 、2D or others | |||||
| Core pitch error(um) | 0.3 | 0.5 | 0.5 | 0.8 | 1 | |
Dimensions (LxWxH) (mm) | 2*0.8*0.8 | 3*1.5*1 | 4*2*1 | 5*3*1 | 6*5*1 | 8*7*1.5 |
Such products are mainly used in the field of silicon light, for chip coupling
